Superior thermal conductivity ensures efficient heat removal in high-power devices.
Wide bandgap and high breakdown voltage make CVD diamonds ideal for high-voltage power electronics.
Mechanical hardness and chemical inertness ensure long-term reliability in harsh environments
CVD diamonds support faster switching speeds in RF and high-frequency applications.
CVD diamonds support faster switching speeds in RF and high-frequency applications.
CVD diamonds enable the development of practical, room-temperature quantum computing devices.
Leveraging cutting-edge CVD technology, we produce both polycrystalline and single-crystal diamonds engineered for semiconductor applications. These diamonds offer exceptional thermal conductivity and mechanical strength, making them ideal for high-performance semiconductor devices.
Superior thermal conductivity enables efficient heat dissipation in IGBTs, Schottky diodes, and power transistors, enhancing their performance and longevity.
CVD diamonds support faster switching speeds and higher frequencies in RF amplifiers and microwave devices due to their wide bandgap and high electron mobility.
Nitrogen-vacancy (NV) centres in CVD diamonds serve as qubits for quantum processors and sensors, operating at room temperature with long coherence times.
CVD diamonds are used as heat sinks and spreaders in high-power electronics and optoelectronic devices to manage heat efficiently.
In laser diodes and high-power LEDs, CVD diamonds improve thermal management, ensuring stable and long-lasting operation.
CVD diamonds enhance the thermal and electrical performance of wide bandgap materials like GaN and SiC, enabling higher efficiency, faster switching speeds, and improved reliability in high-power and high-frequency applications.
In high-performance applications, especially in advanced electronics, laser systems, and quantum technologies, CVD diamonds clearly outperform traditional materials, offering the best balance of thermal conductivity, electrical insulation, and mechanical strength.
| Property | Diamond | Copper | Aluminum | Aluminum Nitride (AlN) | Thermal Grease |
|---|---|---|---|---|---|
| Thermal Conductivity | 1000-2200 W/m·K | 400 W/m·K | 205 W/m·K | 140-180 W/m·K | 1-5 W/m·K |
| Electrical Insulation | Yes (Very high resistivity) | No (Good conductor) | No | Yes (Good insulator) | Yes |
| Mechanical Strength | Extremely high hardness | Moderate | Low | High | N/A (soft material) |
| Weight/Density | 3.52 g/cm³ (light weight) | 8.96 g/cm³ (light weight) | 2.7 g/cm³ (light weight) | ~3.26 g/cm³ | N/A (used in small amounts) |
| Operating Temperature Range | Up to 1000°C | Up to 400°C | Up to 300°C | Up to 300°C | 100 - 150°C |
| Thermal Expansion | Very low (1.2 x 10⁻⁶/°C) | High (16.5 x 10⁻⁶/°C) | Moderate (23 x 10⁻⁶/°C) | Low (4 x 10⁻⁶/°C) | N/A |
| Applications | High-power electronics, RF devices, laser diodes, quantum computing | Heat sinks, heat exchangers | Heat sinks, lightweight housings | Power electronics, semiconductor cooling | CPU/GPU thermal interface |